Module manufacture


"For each production task, there is a production method that is the most economically efficient."
Our module manufacture is carried out under
this guiding principle.

Placement
  • Modern Mimot automatic placement machines (MIMOT Advantage) are used in the SMD/SMT (surface mounted devices/technology) area. Components from type 0402, fine-pitch, BGAs as well as special components can be processed.
  • In the THT (through hole technology) area, manual work stations and corresponding accessories (for example, possibilities for component preparation or cable manufacture) are employed.

Soldering
  • Soldering is carried out, according to customer specifications, with lead-based or lead-free solder using nitrogen.
  • Mechanical reflow soldering and wave soldering (computer-controlled Wörthmann wave) processes are used.
  • A Zevac selective wave (PCBRM-10) as well as manual soldering are alternatively available.
  • A modern rework station (ERSA) is used for both repairs and special applications.

Partial coating of PCBs
  • Module coating with different functions:
    as a protective coating, to ensure radio-frequency strength, to increase dielectric strength
  • Processing of all air-dried media, e.g. radio-frequency
  • paint, insulating varnish, low- to high-viscosity masking lacquer
  • CNC-controlled fully automatic machine

back
Imageprospekt BRITZE Elektronik
Download
Overview printed materials

Sales

TÜV-Certified
TÜV-Certified